Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.
Project Title - E3 & FDC tools development for Wire Bond process.
Project Description - Manufacturing requires design and deploy robust, sustainable process control methods and strategies to support manufacturing challenges in obtaining higher cumulative yields, faster time to market and reduced operating costs. E3 & FDC tool detects abnormal processing by monitoring tool sensor data with user-defined control specifications in real-time and/or after the run completes. This project has required the candidate to analyze and enable the required data from the machine. Candidate needs to demonstrate statistical analysis on the correlation between E3 & FD real-time data with potential Wire Bond defects.
Required Skills and Abilities
- Degree in Electrical & Electronics Eng/ Mechanical Eng.
- Job type:Internships
Engineering Electrical, Engineering Mechanical
- Closing Date:3rd Jul 2020, 6:00 pm