Intern - Die Attach Process Engineer

The Programme

Project Title:

• Study on the machine portabilities towards crack die improvement. 
• Study and suggest inline detection.

Description: 

• To improve inline detection and reduce defect occurrence at the Die Attach process.

Scope:

• Engage with different teams to enable machine-to-machine portabilities overview. 
• Running test run (DOE). 
• Data collection and analysis during the setup.

Supporting Team:

• IT Team. 
• Engineering Team. 
• QA Team.

Results:

• Result from the machine-to-machine possibilities correlate with crack die. 
• Able to come up with suggestions/solutions to improve Die Attach inline detection. 
• Apply and enhance machine signal to supervise and improve.

Our vision is to transform how the world uses information to enrich life for all. 
 
About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.  

With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.  

Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.