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Industrial Trainee - UPD Thinning

The Programme 

Part of your life. Part of tomorrow - We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources. 

What You Will Do

In your new role you will:

  • Support process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
  • Support integration block re-use and tool extendibility to maximize re-use strategy.
  • Perform FMEA, risk assessment of process changes and process change management.
  • Support excursion prevention, productivity and quality improvement projects. 

Required Skills and Abilities 

  • Internship for Bachelor’s degree in Mechanical Engineering, Material Science or Applied Science. 
  • Some hands-on experience in wafer fab thinning processes, and related equipment engineering is preferred.
  • Have good methodical technique in technology synchronization and process harmonization.
  • Good knowledge in semiconductor unit processes, process integration, device physics and products will be of added advantage.
  • Highly innovative, motivated and stress resistant individual with zero defect mindset.
  • A good team player and able to communicate effectively in cross functional teams and at all levels.
  • Able to communicate effectively in English. 
Closing in 6 days
Closing in 6 days
  • Job type:Internships
  • Disciplines:

    Engineering Mechanical, Science

  • Citizenships:

  • Locations:

    Kulim

  • Closing Date:22nd May 2021, 6:00 pm

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